제품소개
By domesticating semiconductor tapes, we compete with industry-leading companies, providing the highest quality and most advanced products.
Dicing Tape
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- Prevents chipping and chip flying issues during the wafer dicing process. After UV irradiation, the adhesion decreases, allowing easy die pick-up without contamination or damage.
- A non-UV solution is also available upon request.
Applications
- Semiconductor chip dicing process
Representative Structure
- PSA(Non-UV Type , UV Type)
- Base Film(PVC , PO)
Key Features
Excellent aging stability, Superior adhesive performance, Residue-free peeling after UV irradiation
