제품소개
By domesticating semiconductor tapes, we compete with industry-leading companies, providing the highest quality and most advanced products.
Back Grinding Tape
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- Prevents breakage (cracking) and warpage during the back grinding process.
- Designed to eliminate bubbles during lamination, ensuring that no tape residue remains on the wafer surface after peeling.
Applications
- Back grinding process for semiconductor wafers
Representative Structure
- PSA( Non-UV Type , UV Type)
- Base Film(PO)
Key Features
Excellent thickness uniformity performance, Superior processability for wafer backside processing, Residue-free peeling with outstanding adhesive performance
